Epoxy resin potting: JX-501
JX-501 system of solvent-free low-viscosity potting epoxy resin at room temperature curing, curing with moisture resistance, electrical and mechanical properties. Applicable to electronic components at room temperature potting.
First, the product features and technical parameters:
|
project |
Test parameters or conditions |
JX-501A |
JX-501B |
|
Whitegrass appearance |
Visual inspection |
Colorless and transparent |
Colorless and transparent |
|
proportion |
25℃ |
1.15--1.25 |
1.10-1.15 |
|
Viscosity |
40℃ cps |
200--300 |
70--90 |
|
Mixed viscosity |
40℃ cps |
150--250 |
|
Post-cure characteristics |
|
Project |
Unit or condition |
JX-501 |
|
Hardness |
Shore--D |
70-80 |
|
Volume resistance |
25℃ |
5×10 13 |
|
Surface resistance |
25℃ |
3.0×10 11 |
|
Compressive strength |
MPa |
7-8 |
|
Bending strength |
MPa |
5-6 |
Second, use:
1. Use ratio: JX-501A glue: JX-501B glue = 100: 50
2. Conditions of Use: 25 ° C X 10H-12H or 60 ° C X 1 H
Third, storage and transportation:
1. sealed at room temperature 25 ℃ cool, dry place, the shelf life of 6 months.
2. Transport process is strictly prohibited high temperature, sun, rain.
3. Strict storage requirements Storage, away from high temperature and fire, so first-in first-out, product storage area should be no smoking area.
Fourth, pay attention to matters
Once the epoxy resin hardened, it is difficult to remove. So that the tool or the reactor is cleaned with a solvent immediately after mixing, such as acetone, xylene or toluene. So that after the hardening of the device can no longer use. |
