Epoxy resin potting: JX-505
JX-505 is solvent-free low-viscosity potting epoxy resin at room temperature curing, curing with moisture resistance, electrical and mechanical properties. Applicable to electronic components at room temperature potting.
First, the product features and technical parameters:
|
project |
Test parameters or conditions |
JX-505A |
JX-505B |
|
Whitegrass appearance |
Visual inspection |
黑色粘稠液體 |
黃棕色液體 |
|
proportion |
25℃ |
1.15--1.25 |
0.85-1.05 |
|
Viscosity |
40℃ cps |
1500--1600 |
100--120 |
|
Mixed viscosity |
40℃ cps |
250--350 |
|
Post-cure characteristics |
|
Project |
Unit or condition |
JX-505 |
|
Hardness |
Shore--D |
80 |
|
Volume resistance |
25℃ |
1.5×10 16 |
|
Surface resistance |
25℃ |
1.2×10 15 |
|
Compressive strength |
MPa |
8-9 |
|
Bending strength |
MPa |
9-10 |
Second, use:
1. Use ratio: JX-505A glue: JX-505B glue = 5: 1
2. Conditions of Use: 25 ° C X 10H-12H or 60 ° C X 2 H
Third, storage and transportation:
1. sealed at room temperature 25 ℃ cool, dry place, the shelf life of 6 months.
2. Transport process is strictly prohibited high temperature, sun, rain.
3. Strict storage requirements Storage, away from high temperature and fire, so first-in first-out, product storage area should be no smoking area.
Fourth, pay attention to matters
Once the epoxy resin hardened, it is difficult to remove. So that the tool or the reactor is cleaned with a solvent immediately after mixing, such as acetone, xylene or toluene. So that after the hardening of the device can no longer use.
The other can be packaged according to customer demand |
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